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Samsung and AMD have agreed to expand their long‑running partnership to develop the next generation of memory and computing technology for AI systems. The two companies signed a Memorandum of Understanding at Samsung’s advanced chip facility in Pyeongtaek, Korea, with AMD CEO Dr Lisa Su and Samsung CEO Young Hyun Jun in attendance.
The agreement focuses on Samsung supplying HBM4 memory for AMD’s upcoming Instinct MI455X GPU and developing new DDR5 memory for AMD’s next generation of EPYC processors. These components will support future AI systems built around AMD’s Helios rack‑scale architecture, which combines GPUs, CPUs and system‑level design to handle increasingly demanding AI workloads.
Both companies said the collaboration reflects the growing need for tight integration between processors and memory as AI models become larger and more complex. They noted that higher bandwidth and better power efficiency are now essential for data‑centre performance.
Samsung highlighted that its HBM4 technology is already in mass production and built on its most advanced DRAM process. AMD said the MI455X GPU will rely on this memory to deliver the performance required for training and running AI models at scale.
The companies will also explore opportunities for Samsung to provide foundry services for future AMD products. Their partnership spans nearly twenty years, including Samsung’s role as the main supplier of HBM3E memory for AMD’s current Instinct accelerators.
