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Samsung is on track to be the first manufacturer to roll out its 10nm process to the mass market. Piping both Intel and TSMC to the post, Samsung is the first of the big players to announce that it is nearly ready to mass produce its 10nm FinFET process for chip production.
Expected to be used within Samsung’s Exynos 8895 chips as well as Qualcomm’s Snapdragon 835 and Centriq 2400 server chip, the 10nm FinFET process will be ready in the coming months. In fact, Samsung said that it has already shipped 70,000 silicon wafers using the first generation 10nm Low Power Early (LPE) process technology.
Refusing to rest on its laurels, Samsung continues to speed up its development to stay ahead of its competitors. In 2015, the company started producing 14nm FinFET chips, and just two years later it is ready to unveil its 10nm process. Compared to the 14nm process the 10nm process will allow chips to run 27 per cent faster and 40 per cent more efficiently, according to Samsung.
“Samsung’s 10nm LPE is a game changer in the foundry industry,” said Jongshik Yoon, executive vice president and head of Foundry Business at Samsung Electronics. “The 10nm LPP and LPU will enter mass production by the end of the year and next year, respectively. We will continue to offer the most competitive process technology in the industry.”
Not satisfied 10nm, Samsung has already begun working on 8nm, 7nm, and 6nm process technologies. Expecting to reach 7nm by 2019, the company has recently partnered with IBM to speed up the development process. More details about future release dates are expected at the US Samsung Foundry Forum in May.
